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High-precision half-automated grinding and polishing machine MultiPrepTEM System8
MultiPrep™ System 8” for TEM sample prep grinding and polishing machine is designed for high-precision semiautomatic sample preparation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof.Dual micrometers allow precise control sample tilt adjustments and also MultiPrep™ System 8” for TEM sample prep grinding and polishing machine is allows to control real-time material removal during grinding. Adjustable load control expands its capability to handle a range of small (delicate) to large samples.
Production year, manufacturer, country of manufacture: 2018, Allied, USA
Technical characteristics:
The diameter of the drive wheel – 203 mm
Rotation speed of the drive wheel – 5-350 rpm with increments of 5 rpm
Accuracy of control of the amount of material removal 1 μm
2-axis micrometer-controlled angular positioning of the sample within ÷10/-2.5° with an accuracy of 0.02 °
The loading range is 0-600 g with increments of 100 g.
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